A Fully Integrated SPAD Sensor with Photoluminescent Encapsulation and Die-Bonded μLEDs for Implantable Oxygen Monitoring

Julian A. Singer, Anton Geläschus, Ute Schmidt, Andreas Bahr, Matthias Kuhl, Qiang Li. A Fully Integrated SPAD Sensor with Photoluminescent Encapsulation and Die-Bonded μLEDs for Implantable Oxygen Monitoring. In IEEE Custom Integrated Circuits Conference, CICC 2026, Seattle, WA, USA, April 19-23, 2026. pages 1-4, IEEE, 2026. [doi]

@inproceedings{SingerGSBKL26,
  title = {A Fully Integrated SPAD Sensor with Photoluminescent Encapsulation and Die-Bonded μLEDs for Implantable Oxygen Monitoring},
  author = {Julian A. Singer and Anton Geläschus and Ute Schmidt and Andreas Bahr and Matthias Kuhl and Qiang Li},
  year = {2026},
  doi = {10.1109/CICC65509.2026.11509508},
  url = {https://doi.org/10.1109/CICC65509.2026.11509508},
  researchr = {https://researchr.org/publication/SingerGSBKL26},
  cites = {0},
  citedby = {0},
  pages = {1-4},
  booktitle = {IEEE Custom Integrated Circuits Conference, CICC 2026, Seattle, WA, USA, April 19-23, 2026},
  publisher = {IEEE},
  isbn = {979-8-3315-7210-5},
}