A Fully Integrated SPAD Sensor with Photoluminescent Encapsulation and Die-Bonded μLEDs for Implantable Oxygen Monitoring

Julian A. Singer, Anton Geläschus, Ute Schmidt, Andreas Bahr, Matthias Kuhl, Qiang Li. A Fully Integrated SPAD Sensor with Photoluminescent Encapsulation and Die-Bonded μLEDs for Implantable Oxygen Monitoring. In IEEE Custom Integrated Circuits Conference, CICC 2026, Seattle, WA, USA, April 19-23, 2026. pages 1-4, IEEE, 2026. [doi]

Abstract

Abstract is missing.