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Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion

Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, M. A. J. van Gils. Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. Microelectronics Reliability, 47(12):1975-1982, 2007. [doi]

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Olaf van der Sluis

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R. A. B. Engelen

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Richard B. R. van Silfhout

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W. D. van Driel

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M. A. J. van Gils

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