Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, M. A. J. van Gils. Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. Microelectronics Reliability, 47(12):1975-1982, 2007. [doi]
@article{SluisESDG07,
title = {Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion},
author = {Olaf van der Sluis and R. A. B. Engelen and Richard B. R. van Silfhout and W. D. van Driel and M. A. J. van Gils},
year = {2007},
doi = {10.1016/j.microrel.2007.04.004},
url = {http://dx.doi.org/10.1016/j.microrel.2007.04.004},
tags = {analysis},
researchr = {https://researchr.org/publication/SluisESDG07},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {47},
number = {12},
pages = {1975-1982},
}