Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, M. A. J. van Gils. Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. Microelectronics Reliability, 47(12):1975-1982, 2007. [doi]
@article{SluisESDG07, title = {Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion}, author = {Olaf van der Sluis and R. A. B. Engelen and Richard B. R. van Silfhout and W. D. van Driel and M. A. J. van Gils}, year = {2007}, doi = {10.1016/j.microrel.2007.04.004}, url = {http://dx.doi.org/10.1016/j.microrel.2007.04.004}, tags = {analysis}, researchr = {https://researchr.org/publication/SluisESDG07}, cites = {0}, citedby = {0}, journal = {Microelectronics Reliability}, volume = {47}, number = {12}, pages = {1975-1982}, }