Richard B. R. van Silfhout - researchr alias

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Viewing Publication 1 - 5 from 5

2010

Prediction of the epoxy moulding compound aging effect on package reliabilitySander Noijen, Roy Engelen, Joerg Martens, Alexandru Opran, Olaf van der Sluis, Richard B. R. van Silfhout. mr, 50(7):917-922, 2010. [doi]

2007

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterionOlaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, M. A. J. van Gils. mr, 47(12):1975-1982, 2007. [doi]

Molecular simulation on the material/interfacial strength of the low-dielectric materialsCadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout. mr, 47(9-11):1483-1491, 2007. [doi]

2004

Prediction of crack growth in IC passivation layersY. T. He, M. A. J. van Gils, Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, Leo J. Ernst. mr, 44(12):2003-2009, 2004. [doi]

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methodsWillem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, M. A. J. van Gils, Leo J. Ernst. mr, 44(12):2019-2027, 2004. [doi]

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