Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, M. A. J. van Gils, Leo J. Ernst. Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. Microelectronics Reliability, 44(12):2019-2027, 2004. [doi]

Abstract

Abstract is missing.