Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, M. A. J. van Gils, Leo J. Ernst. Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. Microelectronics Reliability, 44(12):2019-2027, 2004. [doi]
@article{DrielLZJSGE04,
title = {Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods},
author = {Willem D. van Driel and C. J. Liu and G. Q. Zhang and J. H. J. Janssen and Richard B. R. van Silfhout and M. A. J. van Gils and Leo J. Ernst},
year = {2004},
doi = {10.1016/j.microrel.2004.05.002},
url = {http://dx.doi.org/10.1016/j.microrel.2004.05.002},
researchr = {https://researchr.org/publication/DrielLZJSGE04},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {44},
number = {12},
pages = {2019-2027},
}