Hanna Soneda, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu. Electrical Field Test Method of Resistive Open Defects between Dies by Quiescent Currents through Embedded Diodes. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-5, IEEE, 2019. [doi]
@inproceedings{SonedaHYL19,
title = {Electrical Field Test Method of Resistive Open Defects between Dies by Quiescent Currents through Embedded Diodes},
author = {Hanna Soneda and Masaki Hashizume and Hiroyuki Yotsuyanagi and Shyue-Kung Lu},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058777},
url = {https://doi.org/10.1109/3DIC48104.2019.9058777},
researchr = {https://researchr.org/publication/SonedaHYL19},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}