Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs - researchr publication authors

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Taigon Song, Chang Liu, Dae-Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon. Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. In Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011, Santa Clara, California, USA, 14-16 March 2011. pages 122-128, IEEE, 2011. [doi]

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