Taigon Song, Chang Liu, Dae-Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon. Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. In Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011, Santa Clara, California, USA, 14-16 March 2011. pages 122-128, IEEE, 2011. [doi]
@inproceedings{SongLKLCKPAKY11,
title = {Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs},
author = {Taigon Song and Chang Liu and Dae-Hyun Kim and Sung Kyu Lim and Jonghyun Cho and Joohee Kim and Junso Pak and Seungyoung Ahn and Joungho Kim and Kihyun Yoon},
year = {2011},
doi = {10.1109/ISQED.2011.5770714},
url = {http://dx.doi.org/10.1109/ISQED.2011.5770714},
tags = {analysis, termination},
researchr = {https://researchr.org/publication/SongLKLCKPAKY11},
cites = {0},
citedby = {0},
pages = {122-128},
booktitle = {Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011, Santa Clara, California, USA, 14-16 March 2011},
publisher = {IEEE},
isbn = {978-1-61284-914-0},
}