More Power Reduction With 3-Tier Logic-on-Logic 3-D ICs

Taigon Song, Shreepad Panth, Yoo-Jin Chae, Sung Kyu Lim. More Power Reduction With 3-Tier Logic-on-Logic 3-D ICs. IEEE Trans. on CAD of Integrated Circuits and Systems, 35(12):2056-2067, 2016. [doi]

Abstract

Abstract is missing.