3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling

Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, Thomas Brunschwiler, David Atienza. 3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling. In 2010 International Conference on Computer-Aided Design (ICCAD 10), November 7-11, 2010, San Jose, CA, USA. pages 463-470, IEEE, 2010. [doi]

Abstract

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