Srivatsa Rangachar Srinivasa, Karthik Mohan, Wei-Hao Chen, Kuo-Hsinag Hsu, Xueqing Li, Meng-Fan Chang, Sumeet Kumar Gupta, John Sampson, Vijaykrishnan Narayanan. Improving FPGA Design with Monolithic 3D Integration Using High Dense Inter-Stack Via. In 2017 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2017, Bochum, Germany, July 3-5, 2017. pages 128-133, IEEE, 2017. [doi]
Abstract is missing.