Srivatsa Rangachar Srinivasa, Jainaveen Sundaram Priya, Dileep Kurian, Erika Ramirez Lozano, Satish Yada, Saransh Chhabra, Kamakhya Prasad Sahu, Paolo A. Aseron, Ronald Kalim, Anuradha Srinivasan, Tanay Karnik. Design Methodology for Scalable 2.5D/3D Heterogenous Tiled Chiplet Systems. In 23rd International Symposium on Quality Electronic Design, ISQED 2022, Santa Clara, CA, USA, April 6-7, 2022. pages 1-4, IEEE, 2022. [doi]
@inproceedings{SrinivasaPKLYCS22,
title = {Design Methodology for Scalable 2.5D/3D Heterogenous Tiled Chiplet Systems},
author = {Srivatsa Rangachar Srinivasa and Jainaveen Sundaram Priya and Dileep Kurian and Erika Ramirez Lozano and Satish Yada and Saransh Chhabra and Kamakhya Prasad Sahu and Paolo A. Aseron and Ronald Kalim and Anuradha Srinivasan and Tanay Karnik},
year = {2022},
doi = {10.1109/ISQED54688.2022.9806262},
url = {https://doi.org/10.1109/ISQED54688.2022.9806262},
researchr = {https://researchr.org/publication/SrinivasaPKLYCS22},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {23rd International Symposium on Quality Electronic Design, ISQED 2022, Santa Clara, CA, USA, April 6-7, 2022},
publisher = {IEEE},
isbn = {978-1-6654-9466-3},
}