Design Methodology for Scalable 2.5D/3D Heterogenous Tiled Chiplet Systems

Srivatsa Rangachar Srinivasa, Jainaveen Sundaram Priya, Dileep Kurian, Erika Ramirez Lozano, Satish Yada, Saransh Chhabra, Kamakhya Prasad Sahu, Paolo A. Aseron, Ronald Kalim, Anuradha Srinivasan, Tanay Karnik. Design Methodology for Scalable 2.5D/3D Heterogenous Tiled Chiplet Systems. In 23rd International Symposium on Quality Electronic Design, ISQED 2022, Santa Clara, CA, USA, April 6-7, 2022. pages 1-4, IEEE, 2022. [doi]

Abstract

Abstract is missing.