High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate - researchr publication authors

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Navin Srivastava, Roberto Suaya, Kaustav Banerjee. High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate. In Design, Automation and Test in Europe, DATE 2008, Munich, Germany, March 10-14, 2008. pages 426-431, 2008. [doi]

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