Navin Srivastava, Roberto Suaya, Kaustav Banerjee. High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate. In Design, Automation and Test in Europe, DATE 2008, Munich, Germany, March 10-14, 2008. pages 426-431, 2008. [doi]
Abstract is missing.