Navin Srivastava, Roberto Suaya, Kaustav Banerjee. Efficient 3D high-frequency impedance extraction for general interconnects and inductors above a layered substrate. In Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010. pages 459-464, IEEE, 2010. [doi]
@inproceedings{SrivastavaSB10,
title = {Efficient 3D high-frequency impedance extraction for general interconnects and inductors above a layered substrate},
author = {Navin Srivastava and Roberto Suaya and Kaustav Banerjee},
year = {2010},
url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5457162},
researchr = {https://researchr.org/publication/SrivastavaSB10},
cites = {0},
citedby = {0},
pages = {459-464},
booktitle = {Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010},
publisher = {IEEE},
}