The following publications are possibly variants of this publication:
- Fast High-Frequency Impedance Extraction of Horizontal Interconnects and Inductors in 3-D ICs With Multiple SubstratesChuan Xu, Navin Srivastava, Roberto Suaya, Kaustav Banerjee. tcad, 31(11):1698-1710, 2012. [doi]
- High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting SubstrateNavin Srivastava, Roberto Suaya, Kaustav Banerjee. date 2008: 426-431 [doi]
- Analytical Expressions for High-Frequency VLSI Interconnect Impedance Extraction in the Presence of a Multilayer Conductive SubstrateNavin Srivastava, Roberto Suaya, K. Banerjee. tcad, 28(7):1047-1060, 2009. [doi]
- Corrections to Analytical Expressions for High-Frequency VLSI Interconnect Impedance Extraction in the Presence of a Multilayer Conductive Substrate [Jul 09 1047-1060]Navin Srivastava, Chuan Xu, Roberto Suaya, Kaustav Banerjee. tcad, 29(5):849, 2010. [doi]