Low-loss shielded through-silicon vias filled with multi-walled carbon nanotube bundle

Jinrong Su, Runbo Ma, Xinwei Chen, Liping Han, Rongcao Yang, Wenmei Zhang. Low-loss shielded through-silicon vias filled with multi-walled carbon nanotube bundle. Microelectronics Journal, 58:83-88, 2016. [doi]

Abstract

Abstract is missing.