Daisuke Suga, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu. Electrical interconnect test method of 3D ICs by injected charge volume. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
@inproceedings{SugaHYL15,
title = {Electrical interconnect test method of 3D ICs by injected charge volume},
author = {Daisuke Suga and Masaki Hashizume and Hiroyuki Yotsuyanagi and Shyue-Kung Lu},
year = {2015},
doi = {10.1109/3DIC.2015.7334588},
url = {http://dx.doi.org/10.1109/3DIC.2015.7334588},
researchr = {https://researchr.org/publication/SugaHYL15},
cites = {0},
citedby = {0},
booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015},
publisher = {IEEE},
isbn = {978-1-4673-9385-0},
}