Daisuke Suga, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu. Electrical interconnect test method of 3D ICs by injected charge volume. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
Abstract is missing.