Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy, Henrik Hovsepyan, Ara Markosian, Ehrenfried Zschech, Rene Huebner. Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance. J. Electronic Testing, 28(1):63-72, 2012. [doi]
Abstract is missing.