Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires - researchr publication authors

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Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan. Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. IEEE Trans. on CAD of Integrated Circuits and Systems, 37(12):3137-3150, 2018. [doi]

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