Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan. Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. IEEE Trans. on CAD of Integrated Circuits and Systems, 37(12):3137-3150, 2018. [doi]
Abstract is missing.