Over 10-times high-speed, energy efficient 3D TSV-integrated hybrid ReRAM/MLC NAND SSD by intelligent data fragmentation suppression

Chao Sun, Hiroki Fujii, Kousuke Miyaji, Koh Johguchi, Kazuhide Higuchi, Ken Takeuchi. Over 10-times high-speed, energy efficient 3D TSV-integrated hybrid ReRAM/MLC NAND SSD by intelligent data fragmentation suppression. In 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, January 22-25, 2013. pages 81-82, IEEE, 2013. [doi]

Authors

Chao Sun

This author has not been identified. Look up 'Chao Sun' in Google

Hiroki Fujii

This author has not been identified. Look up 'Hiroki Fujii' in Google

Kousuke Miyaji

This author has not been identified. Look up 'Kousuke Miyaji' in Google

Koh Johguchi

This author has not been identified. Look up 'Koh Johguchi' in Google

Kazuhide Higuchi

This author has not been identified. Look up 'Kazuhide Higuchi' in Google

Ken Takeuchi

This author has not been identified. Look up 'Ken Takeuchi' in Google