Over 10-times high-speed, energy efficient 3D TSV-integrated hybrid ReRAM/MLC NAND SSD by intelligent data fragmentation suppression

Chao Sun, Hiroki Fujii, Kousuke Miyaji, Koh Johguchi, Kazuhide Higuchi, Ken Takeuchi. Over 10-times high-speed, energy efficient 3D TSV-integrated hybrid ReRAM/MLC NAND SSD by intelligent data fragmentation suppression. In 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, January 22-25, 2013. pages 81-82, IEEE, 2013. [doi]

@inproceedings{SunFMJHT13,
  title = {Over 10-times high-speed, energy efficient 3D TSV-integrated hybrid ReRAM/MLC NAND SSD by intelligent data fragmentation suppression},
  author = {Chao Sun and Hiroki Fujii and Kousuke Miyaji and Koh Johguchi and Kazuhide Higuchi and Ken Takeuchi},
  year = {2013},
  doi = {10.1109/ASPDAC.2013.6509566},
  url = {http://dx.doi.org/10.1109/ASPDAC.2013.6509566},
  researchr = {https://researchr.org/publication/SunFMJHT13},
  cites = {0},
  citedby = {0},
  pages = {81-82},
  booktitle = {18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, January 22-25, 2013},
  publisher = {IEEE},
  isbn = {978-1-4673-3029-9},
}