Zixuan Sun, Haoran Lu, Yongkang Xue, Wenpu Luo, Zirui Wang, Jiayang Zhang, Zhigang Ji, Runsheng Wang, Ru Huang. Investigation of Hot Carrier Enhanced Body Bias Effect in Advanced FinFET Technology. In IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023. pages 1-6, IEEE, 2023. [doi]
@inproceedings{SunLXLWZJWH23,
title = {Investigation of Hot Carrier Enhanced Body Bias Effect in Advanced FinFET Technology},
author = {Zixuan Sun and Haoran Lu and Yongkang Xue and Wenpu Luo and Zirui Wang and Jiayang Zhang and Zhigang Ji and Runsheng Wang and Ru Huang},
year = {2023},
doi = {10.1109/IRPS48203.2023.10117840},
url = {https://doi.org/10.1109/IRPS48203.2023.10117840},
researchr = {https://researchr.org/publication/SunLXLWZJWH23},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023},
publisher = {IEEE},
isbn = {978-1-6654-5672-2},
}