Analysis of 3D interconnect performance: Effect of the Si substrate resistivity

X. Sun, Geert Van der Plas, Mikael Detalle, Eric Beyne. Analysis of 3D interconnect performance: Effect of the Si substrate resistivity. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-4, IEEE, 2014. [doi]

Abstract

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