Efficient ILT via Multi-level Lithography Simulation

Shuyuan Sun, Fan Yang 0001, Bei Yu 0001, Li Shang, Xuan Zeng 0001. Efficient ILT via Multi-level Lithography Simulation. In 60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, CA, USA, July 9-13, 2023. pages 1-6, IEEE, 2023. [doi]

@inproceedings{SunYYSZ23,
  title = {Efficient ILT via Multi-level Lithography Simulation},
  author = {Shuyuan Sun and Fan Yang 0001 and Bei Yu 0001 and Li Shang and Xuan Zeng 0001},
  year = {2023},
  doi = {10.1109/DAC56929.2023.10247704},
  url = {https://doi.org/10.1109/DAC56929.2023.10247704},
  researchr = {https://researchr.org/publication/SunYYSZ23},
  cites = {0},
  citedby = {0},
  pages = {1-6},
  booktitle = {60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, CA, USA, July 9-13, 2023},
  publisher = {IEEE},
  isbn = {979-8-3503-2348-1},
}