Makoto Suwada, Kazuhiro Kanai. Considerations of TSV effects on next-generation super-high-speed transmission and power integrity design for 300A-class 2.5D and 3D package integration. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-4, IEEE, 2016. [doi]
@inproceedings{SuwadaK16,
title = {Considerations of TSV effects on next-generation super-high-speed transmission and power integrity design for 300A-class 2.5D and 3D package integration},
author = {Makoto Suwada and Kazuhiro Kanai},
year = {2016},
doi = {10.1109/3DIC.2016.7969995},
url = {https://doi.org/10.1109/3DIC.2016.7969995},
researchr = {https://researchr.org/publication/SuwadaK16},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016},
publisher = {IEEE},
isbn = {978-1-5090-1399-9},
}