Raja Swaminathan, Michael J. Schulte, Brett Wilkerson, Gabriel H. Loh, Alan Smith, Norman James. TM MI250X Accelerator enabled by Elevated Fanout Bridge Advanced Packaging Architecture. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-2, IEEE, 2023. [doi]
@inproceedings{SwaminathanSWLS23,
title = {TM MI250X Accelerator enabled by Elevated Fanout Bridge Advanced Packaging Architecture},
author = {Raja Swaminathan and Michael J. Schulte and Brett Wilkerson and Gabriel H. Loh and Alan Smith and Norman James},
year = {2023},
doi = {10.23919/VLSITechnologyandCir57934.2023.10185224},
url = {https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185224},
researchr = {https://researchr.org/publication/SwaminathanSWLS23},
cites = {0},
citedby = {0},
pages = {1-2},
booktitle = {2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023},
publisher = {IEEE},
isbn = {978-4-86348-806-9},
}