TM MI250X Accelerator enabled by Elevated Fanout Bridge Advanced Packaging Architecture

Raja Swaminathan, Michael J. Schulte, Brett Wilkerson, Gabriel H. Loh, Alan Smith, Norman James. TM MI250X Accelerator enabled by Elevated Fanout Bridge Advanced Packaging Architecture. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-2, IEEE, 2023. [doi]

References

No references recorded for this publication.

Cited by

No citations of this publication recorded.