ReSiPI: A Reconfigurable Silicon-Photonic 2.5D Chiplet Network with PCMs for Energy-Efficient Interposer Communication

Ebadollah Taheri, Sudeep Pasricha, Mahdi Nikdast. ReSiPI: A Reconfigurable Silicon-Photonic 2.5D Chiplet Network with PCMs for Energy-Efficient Interposer Communication. In Tulika Mitra, Evangeline Young, Jinjun Xiong, editors, Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2022, San Diego, California, USA, 30 October 2022 - 3 November 2022. pages 24, ACM, 2022. [doi]

@inproceedings{TaheriPN22-0,
  title = {ReSiPI: A Reconfigurable Silicon-Photonic 2.5D Chiplet Network with PCMs for Energy-Efficient Interposer Communication},
  author = {Ebadollah Taheri and Sudeep Pasricha and Mahdi Nikdast},
  year = {2022},
  doi = {10.1145/3508352.3549432},
  url = {https://doi.org/10.1145/3508352.3549432},
  researchr = {https://researchr.org/publication/TaheriPN22-0},
  cites = {0},
  citedby = {0},
  pages = {24},
  booktitle = {Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2022, San Diego, California, USA, 30 October 2022 - 3 November 2022},
  editor = {Tulika Mitra and Evangeline Young and Jinjun Xiong},
  publisher = {ACM},
  isbn = {978-1-4503-9217-4},
}