ReSiPI: A Reconfigurable Silicon-Photonic 2.5D Chiplet Network with PCMs for Energy-Efficient Interposer Communication

Ebadollah Taheri, Sudeep Pasricha, Mahdi Nikdast. ReSiPI: A Reconfigurable Silicon-Photonic 2.5D Chiplet Network with PCMs for Energy-Efficient Interposer Communication. In Tulika Mitra, Evangeline Young, Jinjun Xiong, editors, Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2022, San Diego, California, USA, 30 October 2022 - 3 November 2022. pages 24, ACM, 2022. [doi]

Abstract

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