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Thermal management in System-on-Package structures by applying microscale heat sink. Part I: Consideration of the appropriate channel length of microscale heat sink(s)

G. Takács, Péter G. Szabó, György Bognár. Thermal management in System-on-Package structures by applying microscale heat sink. Part I: Consideration of the appropriate channel length of microscale heat sink(s). Microelectronics Journal, 46(12):1202-1207, 2015. [doi]

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