Fan-Hsuan Tang, Hsu-Yu Kao, Shih-Hsu Huang, Jin-Fu Li. 3D Test Wrapper Chain Optimization with I/O Cells Binding Considered. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
Abstract is missing.