Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system - researchr publication authors

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Yanan Tao, Chao Liang, Ziqi Mei, Zhiqiang Song, Yu Wu, Yunna Sun, Wenqiang Zhang, Yong Ruan, Xiaoguang Zhao. Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system. Microelectronics Journal, 144:106089, February 2024. [doi]

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