Yanan Tao, Chao Liang, Ziqi Mei, Zhiqiang Song, Yu Wu, Yunna Sun, Wenqiang Zhang, Yong Ruan, Xiaoguang Zhao. Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system. Microelectronics Journal, 144:106089, February 2024. [doi]
@article{TaoLMSWSZRZ24,
title = {Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system},
author = {Yanan Tao and Chao Liang and Ziqi Mei and Zhiqiang Song and Yu Wu and Yunna Sun and Wenqiang Zhang and Yong Ruan and Xiaoguang Zhao},
year = {2024},
month = {February},
doi = {10.1016/j.mejo.2024.106089},
url = {https://doi.org/10.1016/j.mejo.2024.106089},
researchr = {https://researchr.org/publication/TaoLMSWSZRZ24},
cites = {0},
citedby = {0},
journal = {Microelectronics Journal},
volume = {144},
pages = {106089},
}