Quality versus cost analysis for 3D Stacked ICs

Mottaqiallah Taouil, Said Hamdioui, Erik Jan Marinissen. Quality versus cost analysis for 3D Stacked ICs. In IEEE 32nd VLSI Test Symposium, VTS 2014, Napa, CA, USA, April 13-17, 2014. pages 1-6, IEEE, 2014. [doi]

@inproceedings{TaouilHM14,
  title = {Quality versus cost analysis for 3D Stacked ICs},
  author = {Mottaqiallah Taouil and Said Hamdioui and Erik Jan Marinissen},
  year = {2014},
  doi = {10.1109/VTS.2014.6818763},
  url = {http://dx.doi.org/10.1109/VTS.2014.6818763},
  researchr = {https://researchr.org/publication/TaouilHM14},
  cites = {0},
  citedby = {0},
  pages = {1-6},
  booktitle = {IEEE 32nd VLSI Test Symposium, VTS 2014, Napa, CA, USA, April 13-17, 2014},
  publisher = {IEEE},
}