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Mottaqiallah Taouil, Said Hamdioui, Erik Jan Marinissen. Quality versus cost analysis for 3D Stacked ICs. In IEEE 32nd VLSI Test Symposium, VTS 2014, Napa, CA, USA, April 13-17, 2014. pages 1-6, IEEE, 2014. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Yield and Cost Analysis or 3D Stacked ICsMottaqiallah Taouil. PhD thesis, Delft University of Technology, Netherlands, 2014. [doi] On modeling and optimizing cost in 3D Stacked-ICsMottaqiallah Taouil, Said Hamdioui, Erik Jan Marinissen. idt 2011: 24-29 [doi] Test Cost Analysis for 3D Die-to-Wafer StackingMottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen. ats 2010: 435-441 [doi]
The following publications are possibly variants of this publication: