23.4 A 56Gb/s 300mW silicon-photonics transmitter in 3D-integrated PIC25G and 55nm BiCMOS technologies

Enrico Temporiti, Gabriele Minoia, Matteo Repossi, Daniele Baldi, Andrea Ghilioni, Francesco Svelto. 23.4 A 56Gb/s 300mW silicon-photonics transmitter in 3D-integrated PIC25G and 55nm BiCMOS technologies. In 2016 IEEE International Solid-State Circuits Conference, ISSCC 2016, San Francisco, CA, USA, January 31 - February 4, 2016. pages 404-405, IEEE, 2016. [doi]

Abstract

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