Characterization of semiconductor interfaces using a modified mixed mode bending apparatus

J. Thijsse, Olaf van der Sluis, J. A. W. van Dommelen, Willem D. van Driel, M. G. D. Geers. Characterization of semiconductor interfaces using a modified mixed mode bending apparatus. Microelectronics Reliability, 48(3):401-407, 2008. [doi]

@article{ThijsseSDDG08,
  title = {Characterization of semiconductor interfaces using a modified mixed mode bending apparatus},
  author = {J. Thijsse and Olaf van der Sluis and J. A. W. van Dommelen and Willem D. van Driel and M. G. D. Geers},
  year = {2008},
  doi = {10.1016/j.microrel.2007.06.003},
  url = {http://dx.doi.org/10.1016/j.microrel.2007.06.003},
  researchr = {https://researchr.org/publication/ThijsseSDDG08},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {48},
  number = {3},
  pages = {401-407},
}