Challenges and capabilities of 3D integration in CMOS imaging sensors

Dominique Thomas, Jean Michailos, Krysten Rochereau. Challenges and capabilities of 3D integration in CMOS imaging sensors. In 49th European Solid-State Device Research Conference, ESSDERC 2019, Cracow, Poland, September 23-26, 2019. pages 54-56, IEEE, 2019. [doi]

Abstract

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