32nm and beyond Multi-VT Ultra-Thin Body and BOX FDSOI: From device to circuit

Olivier Thomas, J.-P. Noel, Claire Fenouillet-Béranger, M.-A. Jaud, J. Dura, P. Perreau, F. Boeuf, François Andrieu, D. Delprat, F. Boedt, Konstantin Bourdelle, Bich-Yen Nguyen, Andrei Vladimirescu, Amara Amara. 32nm and beyond Multi-VT Ultra-Thin Body and BOX FDSOI: From device to circuit. In International Symposium on Circuits and Systems (ISCAS 2010), May 30 - June 2, 2010, Paris, France. pages 1703-1706, IEEE, 2010. [doi]

Abstract

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