A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration - researchr publication authors

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Thorlindur Thorolfsson, Steve Lipa, Paul D. Franzon. A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration. In Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, CICC 2012, San Jose, CA, USA, September 9-12, 2012. pages 1-4, IEEE, 2012. [doi]

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