Thorlindur Thorolfsson, Steve Lipa, Paul D. Franzon. A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration. In Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, CICC 2012, San Jose, CA, USA, September 9-12, 2012. pages 1-4, IEEE, 2012. [doi]
@inproceedings{ThorolfssonLF12,
title = {A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration},
author = {Thorlindur Thorolfsson and Steve Lipa and Paul D. Franzon},
year = {2012},
doi = {10.1109/CICC.2012.6330589},
url = {http://dx.doi.org/10.1109/CICC.2012.6330589},
researchr = {https://researchr.org/publication/ThorolfssonLF12},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, CICC 2012, San Jose, CA, USA, September 9-12, 2012},
publisher = {IEEE},
isbn = {978-1-4673-1555-5},
}