Umamaheswara Rao Tida, Cheng Zhuo, Leibo Liu, Yiyu Shi. Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking. IEEE Trans. on CAD of Integrated Circuits and Systems, 39(2):281-293, 2020. [doi]
@article{TidaZLS20,
title = {Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking},
author = {Umamaheswara Rao Tida and Cheng Zhuo and Leibo Liu and Yiyu Shi},
year = {2020},
doi = {10.1109/TCAD.2018.2887053},
url = {https://doi.org/10.1109/TCAD.2018.2887053},
researchr = {https://researchr.org/publication/TidaZLS20},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {39},
number = {2},
pages = {281-293},
}