Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking

Umamaheswara Rao Tida, Cheng Zhuo, Leibo Liu, Yiyu Shi. Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking. IEEE Trans. on CAD of Integrated Circuits and Systems, 39(2):281-293, 2020. [doi]

Abstract

Abstract is missing.