Mechanical packaging, power, and cooling design for the IBM z13

John G. Torok, Frank E. Bosco, Gary F. Goth, John J. Loparco, M. T. Peets, D. Porter, S. G. Shevach, B. C. Tucker, A. C. VanDeventer, X. Wei, P. A. Wendling, Y. Yu, R. J. Zoodsma. Mechanical packaging, power, and cooling design for the IBM z13. IBM Journal of Research and Development, 59(4/5), 2015. [doi]

References

No references recorded for this publication.

Cited by

No citations of this publication recorded.